Power Module Packaging Industry Market Overview: Growth and InsightsThe power module packaging market is booming, projected to reach $5.3 billion by 2033 with a 9.78% CAGR. Driven by EVs, renewable energy, and miniaturization, this in-depth analysis explores market size, key players (Toshiba, Infineon, Texas Instruments), regional trends, and technological advancements in substrate, die attach, and encapsulation.
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